Magnesium oxide for thermal conductivity

Magnesium oxide for thermal conductivity use:resin composite material,added to thermoplastic resins such as PPS,LCP,PA,etc.to improve thermal conductivity.Thermal interface materials(heat sinks,grease,etc.).

         Magnesium oxide for thermal conductivity is used for thermal conductivity silicone sheets,thermal conductivity resins PA6,PPS.By using different particle size ratios,the thermal conductivity can reach 5W/m K.The high-temperature firing at 1800-2000℃and the unique reaction conditions have improved the strong hygroscopicity of magnesium oxide.After surface treatment,it has better contact with the resin.Lightweight,with high insulation and excellent thermal conductivity,it can be filled in large quantities.Compared to spherical alumina,it has higher thermal conductivity and better processing performance.After surface treatment,it has better contact with the resin.Lightweight,with high insulation and excellent thermal conductivity,it can be filled in large quantities.It is one of the excellent materials for thermal rubber,thermal plastic,and thermal adhesive.
          The process of magnesium sulfate pyrolysis to produce magnesium oxide has achieved energy conservation,environmental protection,and resource utilization of by-products throughout the entire process.Using magnesium oxide instead of ammonia in the process of ammonium sulfite pulping.The alkaline buffer uses magnesium oxide,and all indicators of the slurry can reach a level similar to that of the ammonia water method.Using magnesium oxide as a buffer can easily bleach pulp and promote delignification during the cooking process,reducing pollutant emissions and helping to protect the environment while also reducing costs.
           Magnesium oxide for thermal conductivity use:resin composite material,added to thermoplastic resins such as PPS,LCP,PA,etc.to improve thermal conductivity.Thermal interface materials(heat sinks,grease,etc.).Add a large amount of heat hardening resins such as silicon and acrylic to improve heat dissipation.Semiconductor sealing materials,as the sealing materials for the protection,moisture-proof and insulation of semiconductor devices,are generally fused silica.